%0 Conference Paper %1 conf/isocc/LeeKCK16 %A Lee, Young-Woo %A Kim, Junghwan %A Choi, Inhyuk %A Kang, Sungho %B ISOCC %D 2016 %I IEEE %K dblp %P 129-130 %T A TSV test structure for simultaneously detecting resistive open and bridge defects in 3D-ICs. %U http://dblp.uni-trier.de/db/conf/isocc/isocc2016.html#LeeKCK16 %@ 978-1-5090-3219-8

@inproceedings{conf/isocc/LeeKCK16, added-at = {2017-03-17T00:00:00.000+0100}, author = {Lee, Young-Woo and Kim, Junghwan and Choi, Inhyuk and Kang, Sungho}, biburl = {https://www.bibsonomy.org/bibtex/20116b9ce6d67c39c8c74a9acf0d9e4da/dblp}, booktitle = {ISOCC}, crossref = {conf/isocc/2016}, ee = {http://dx.doi.org/10.1109/ISOCC.2016.7799724}, interhash = {e94052193ad2232ff1e65fdf9715c688}, intrahash = {0116b9ce6d67c39c8c74a9acf0d9e4da}, isbn = {978-1-5090-3219-8}, keywords = {dblp}, pages = {129-130}, publisher = {IEEE}, timestamp = {2017-03-18T11:37:29.000+0100}, title = {A TSV test structure for simultaneously detecting resistive open and bridge defects in 3D-ICs.}, url = {http://dblp.uni-trier.de/db/conf/isocc/isocc2016.html#LeeKCK16}, year = 2016 }