%0 Journal Article %1 journals/et/ShangSLM17 %A Shang, Yuling %A Sun, Liyuan %A Li, Chunquan %A Ma, Jianfeng %D 2017 %J J. Electron. Test. %K dblp %N 4 %P 491-499 %T Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure. %U http://dblp.uni-trier.de/db/journals/et/et33.html#ShangSLM17 %V 33

@article{journals/et/ShangSLM17, added-at = {2021-02-05T00:00:00.000+0100}, author = {Shang, Yuling and Sun, Liyuan and Li, Chunquan and Ma, Jianfeng}, biburl = {https://www.bibsonomy.org/bibtex/2ad33023f95a50c2dd8eb725808cfb3e0/dblp}, ee = {https://doi.org/10.1007/s10836-017-5675-8}, interhash = {20c4289b418f04452d03ffa3e5f4dd59}, intrahash = {ad33023f95a50c2dd8eb725808cfb3e0}, journal = {J. Electron. Test.}, keywords = {dblp}, number = 4, pages = {491-499}, timestamp = {2024-04-08T20:52:46.000+0200}, title = {Test of Mechanical Failure for Via Holes and Solder Joints of Complex Interconnect Structure.}, url = {http://dblp.uni-trier.de/db/journals/et/et33.html#ShangSLM17}, volume = 33, year = 2017 }