Inproceedings,
Thermal modelling of 3D multicore systems in a flip-chip package.
K. Vaddina, T. Mitra, P. Liljeberg, and J. Plosila.SoCC, page 379-383. IEEE, (2010)
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- conf/socc/VaddinaMLP10
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- inproceedings
- booktitle
- SoCC
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- 2010
- pages
- 379-383
- publisher
- IEEE
- crossref
- conf/socc/2010
- ee
- http://dx.doi.org/10.1109/SOCC.2010.5784700
- isbn
- 978-1-4244-6682-5
- url
- http://dblp.uni-trier.de/db/conf/socc/socc2010.html#VaddinaMLP10
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%1 conf/socc/VaddinaMLP10
%A Vaddina, Kameswar Rao
%A Mitra, Tamoghna
%A Liljeberg, Pasi
%A Plosila, Juha
%B SoCC
%D 2010
%E Büchner, Thomas
%E Sridhar, Ramalingam
%E Marshall, Andrew
%E Schuhmann, Norbert
%I IEEE
%K dblp
%P 379-383
%T Thermal modelling of 3D multicore systems in a flip-chip package.
%U http://dblp.uni-trier.de/db/conf/socc/socc2010.html#VaddinaMLP10
%@ 978-1-4244-6682-5
@inproceedings{conf/socc/VaddinaMLP10,
added-at = {2011-09-14T00:00:00.000+0200},
author = {Vaddina, Kameswar Rao and Mitra, Tamoghna and Liljeberg, Pasi and Plosila, Juha},
biburl = {https://www.bibsonomy.org/bibtex/21d0bb38bd6e07ebab3e8612bcf2ccb6f/dblp},
booktitle = {SoCC},
crossref = {conf/socc/2010},
editor = {Büchner, Thomas and Sridhar, Ramalingam and Marshall, Andrew and Schuhmann, Norbert},
ee = {http://dx.doi.org/10.1109/SOCC.2010.5784700},
interhash = {2141d45e02bdfa0cf5ff3baa23f0a724},
intrahash = {1d0bb38bd6e07ebab3e8612bcf2ccb6f},
isbn = {978-1-4244-6682-5},
keywords = {dblp},
pages = {379-383},
publisher = {IEEE},
timestamp = {2011-09-15T11:36:55.000+0200},
title = {Thermal modelling of 3D multicore systems in a flip-chip package.},
url = {http://dblp.uni-trier.de/db/conf/socc/socc2010.html#VaddinaMLP10},
year = 2010
}