%0 Conference Paper %1 conf/date/KimYLAJ11 %A Kim, Dongki %A Yoo, Sungjoo %A Lee, Sunggu %A Ahn, Jung Ho %A Jung, Hyunuk %B DATE %D 2011 %I IEEE %K dblp %P 1333-1338 %T A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC. %U http://dblp.uni-trier.de/db/conf/date/date2011.html#KimYLAJ11 %@ 978-1-61284-208-0

@inproceedings{conf/date/KimYLAJ11, added-at = {2023-03-24T00:00:00.000+0100}, author = {Kim, Dongki and Yoo, Sungjoo and Lee, Sunggu and Ahn, Jung Ho and Jung, Hyunuk}, biburl = {https://www.bibsonomy.org/bibtex/21d3389937180e5c3f7a5ac84db44cadd/dblp}, booktitle = {DATE}, crossref = {conf/date/2011}, ee = {https://doi.ieeecomputersociety.org/10.1109/DATE.2011.5763214}, interhash = {71722aa6471e20ac7731c1c07d3529d4}, intrahash = {1d3389937180e5c3f7a5ac84db44cadd}, isbn = {978-1-61284-208-0}, keywords = {dblp}, pages = {1333-1338}, publisher = {IEEE}, timestamp = {2024-04-10T06:49:01.000+0200}, title = {A quantitative analysis of performance benefits of 3D die stacking on mobile and embedded SoC.}, url = {http://dblp.uni-trier.de/db/conf/date/date2011.html#KimYLAJ11}, year = 2011 }