%0 Conference Paper %1 conf/slip/ChenSZMWPB22 %A Chen, Rongmei %A Sisto, Giuliano %A Zografos, Odysseas %A Milojevic, Dragomir %A Weckx, Pieter %A der Plas, Geert Van %A Beyne, Eric %B SLIP %D 2022 %E Badaroglu, Mustafa %E Dutt, Shantanu %I ACM %K dblp %P 3:1-3:5 %T Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper. %U http://dblp.uni-trier.de/db/conf/slip/slip2022.html#ChenSZMWPB22 %@ 978-1-4503-9536-6

@inproceedings{conf/slip/ChenSZMWPB22, added-at = {2024-03-22T00:00:00.000+0100}, author = {Chen, Rongmei and Sisto, Giuliano and Zografos, Odysseas and Milojevic, Dragomir and Weckx, Pieter and der Plas, Geert Van and Beyne, Eric}, biburl = {https://www.bibsonomy.org/bibtex/23338e7e452f701f1fdd5595c6ffb0a6e/dblp}, booktitle = {SLIP}, crossref = {conf/slip/2022}, editor = {Badaroglu, Mustafa and Dutt, Shantanu}, ee = {https://doi.org/10.1145/3557988.3569716}, interhash = {a0151438495154e1e55ae9504efc09e4}, intrahash = {3338e7e452f701f1fdd5595c6ffb0a6e}, isbn = {978-1-4503-9536-6}, keywords = {dblp}, pages = {3:1-3:5}, publisher = {ACM}, timestamp = {2024-04-09T20:06:39.000+0200}, title = {Opportunities of Chip Power Integrity and Performance Improvement through Wafer Backside (BS) Connection: Invited Paper.}, url = {http://dblp.uni-trier.de/db/conf/slip/slip2022.html#ChenSZMWPB22}, year = 2022 }