%0 Conference Paper %1 conf/3dic/HarrisFDW14 %A Harris, T. Robert %A Franzon, Paul D. %A Davis, W. Rhett %A Wang, Lee %B 3DIC %D 2014 %I IEEE %K dblp %P 1-3 %T Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#HarrisFDW14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/HarrisFDW14, added-at = {2019-10-19T00:00:00.000+0200}, author = {Harris, T. Robert and Franzon, Paul D. and Davis, W. Rhett and Wang, Lee}, biburl = {https://www.bibsonomy.org/bibtex/2408f6886d36ce02c936064bc20956479/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152182}, interhash = {2a0fd1eb15422425fc918eada8117cdc}, intrahash = {408f6886d36ce02c936064bc20956479}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-3}, publisher = {IEEE}, timestamp = {2019-10-22T16:17:17.000+0200}, title = {Thermal effects of heterogeneous interconnects on InP / GaN / Si diverse integrated circuits.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#HarrisFDW14}, year = 2014 }