%0 Conference Paper %1 conf/3dic/KimBKKKJK14 %A Kim, Jonghoon J. %A Bae, Bumhee %A Kim, Sukjin %A Kong, Sunkyu %A Kim, Heegon %A Jung, Daniel H. %A Kim, Joungho %B 3DIC %D 2014 %I IEEE %K dblp %P 1-6 %T Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#KimBKKKJK14 %@ 978-1-4799-8472-5

@inproceedings{conf/3dic/KimBKKKJK14, added-at = {2017-05-21T00:00:00.000+0200}, author = {Kim, Jonghoon J. and Bae, Bumhee and Kim, Sukjin and Kong, Sunkyu and Kim, Heegon and Jung, Daniel H. and Kim, Joungho}, biburl = {https://www.bibsonomy.org/bibtex/240f39b09dbc02da7200859393c359e32/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2014}, ee = {https://doi.org/10.1109/3DIC.2014.7152151}, interhash = {c63ce705f4da92b7c74920958548b9fc}, intrahash = {40f39b09dbc02da7200859393c359e32}, isbn = {978-1-4799-8472-5}, keywords = {dblp}, pages = {1-6}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:22.000+0200}, title = {Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#KimBKKKJK14}, year = 2014 }