%0 Journal Article %1 journals/mr/TsukamotoNSMSN11 %A Tsukamoto, H. %A Nishimura, T. %A Suenaga, S. %A McDonald, Stuart D. %A Sweatman, Keith W. %A Nogita, Kazuhiro %D 2011 %J Microelectron. Reliab. %K dblp %N 3 %P 657-667 %T The influence of solder composition on the impact strength of lead-free solder ball grid array joints. %U http://dblp.uni-trier.de/db/journals/mr/mr51.html#TsukamotoNSMSN11 %V 51

@article{journals/mr/TsukamotoNSMSN11, added-at = {2020-02-22T00:00:00.000+0100}, author = {Tsukamoto, H. and Nishimura, T. and Suenaga, S. and McDonald, Stuart D. and Sweatman, Keith W. and Nogita, Kazuhiro}, biburl = {https://www.bibsonomy.org/bibtex/2412bbed832bdd740c0b680fac2fda4a5/dblp}, ee = {https://doi.org/10.1016/j.microrel.2010.10.012}, interhash = {9cb1bf21c06692557ad3b62ecd27b6fd}, intrahash = {412bbed832bdd740c0b680fac2fda4a5}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 3, pages = {657-667}, timestamp = {2020-02-25T13:27:55.000+0100}, title = {The influence of solder composition on the impact strength of lead-free solder ball grid array joints.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#TsukamotoNSMSN11}, volume = 51, year = 2011 }