%0 Journal Article %1 journals/tvlsi/ChengTYZ16 %A Cheng, Yuanqing %A Todri-Sanial, Aida %A Yang, Jianlei %A Zhao, Weisheng %D 2016 %J IEEE Trans. Very Large Scale Integr. Syst. %K dblp %N 11 %P 3310-3322 %T Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect. %U http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi24.html#ChengTYZ16 %V 24

@article{journals/tvlsi/ChengTYZ16, added-at = {2020-04-05T00:00:00.000+0200}, author = {Cheng, Yuanqing and Todri-Sanial, Aida and Yang, Jianlei and Zhao, Weisheng}, biburl = {https://www.bibsonomy.org/bibtex/26f3d6f15a4e787f6c1cb0316cbfa3e6f/dblp}, ee = {https://doi.org/10.1109/TVLSI.2016.2543260}, interhash = {24c27240f88417db1daacefb091f6b7c}, intrahash = {6f3d6f15a4e787f6c1cb0316cbfa3e6f}, journal = {IEEE Trans. Very Large Scale Integr. Syst.}, keywords = {dblp}, number = 11, pages = {3310-3322}, timestamp = {2020-04-07T11:38:06.000+0200}, title = {Alleviating Through-Silicon-Via Electromigration for 3-D Integrated Circuits Taking Advantage of Self-Healing Effect.}, url = {http://dblp.uni-trier.de/db/journals/tvlsi/tvlsi24.html#ChengTYZ16}, volume = 24, year = 2016 }