%0 Conference Paper %1 conf/apsipa/LeeHPLS23 %A Lee, Chin-Wei %A Hládek, Daniel %A Pleva, Matús %A Liao, Yuan-Fu %A Su, Ming-Hsiang %B APSIPA ASC %D 2023 %I IEEE %K dblp %P 2173-2177 %T Application of Wafer Defect Pattern Classification Model in the Semiconductor Industry. %U http://dblp.uni-trier.de/db/conf/apsipa/apsipa2023.html#LeeHPLS23 %@ 979-8-3503-0067-3

@inproceedings{conf/apsipa/LeeHPLS23, added-at = {2024-02-05T00:00:00.000+0100}, author = {Lee, Chin-Wei and Hládek, Daniel and Pleva, Matús and Liao, Yuan-Fu and Su, Ming-Hsiang}, biburl = {https://www.bibsonomy.org/bibtex/25749e9af603b733fde3bc2a2f08bc346/dblp}, booktitle = {APSIPA ASC}, crossref = {conf/apsipa/2023}, ee = {https://doi.org/10.1109/APSIPAASC58517.2023.10317264}, interhash = {9d48b751c056a7d436292a3b0b2e2b41}, intrahash = {5749e9af603b733fde3bc2a2f08bc346}, isbn = {979-8-3503-0067-3}, keywords = {dblp}, pages = {2173-2177}, publisher = {IEEE}, timestamp = {2024-04-09T11:42:19.000+0200}, title = {Application of Wafer Defect Pattern Classification Model in the Semiconductor Industry.}, url = {http://dblp.uni-trier.de/db/conf/apsipa/apsipa2023.html#LeeHPLS23}, year = 2023 }