%0 Journal Article %1 journals/mr/HochstenbachDYZB10 %A Hochstenbach, Hendrik Pieter %A van Driel, Willem D. %A Yang, Dao-Guo %A Zaal, Jeroen J. M. %A Bagerman, E. %D 2010 %J Microelectron. Reliab. %K dblp %N 4 %P 528-535 %T Designing for reliability using a new Wafer Level Package structure. %U http://dblp.uni-trier.de/db/journals/mr/mr50.html#HochstenbachDYZB10 %V 50

@article{journals/mr/HochstenbachDYZB10, added-at = {2020-02-22T00:00:00.000+0100}, author = {Hochstenbach, Hendrik Pieter and van Driel, Willem D. and Yang, Dao-Guo and Zaal, Jeroen J. M. and Bagerman, E.}, biburl = {https://www.bibsonomy.org/bibtex/264706bfd7d60b4a8f4ddacc78404516a/dblp}, ee = {https://doi.org/10.1016/j.microrel.2009.09.011}, interhash = {cdbb4bb79ce3ce1028ef71ff43d9b8ab}, intrahash = {64706bfd7d60b4a8f4ddacc78404516a}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 4, pages = {528-535}, timestamp = {2020-02-25T13:23:40.000+0100}, title = {Designing for reliability using a new Wafer Level Package structure.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr50.html#HochstenbachDYZB10}, volume = 50, year = 2010 }