Conformable Thin-Film Temperature Sensors on Heat-Shrinkable Substrate for Irregular Surfaces
2023 IEEE SENSORS, page 1-4. (October 2023)DOI: 10.1109/SENSORS56945.2023.10325310
Abstract
Electronics integration in ergonomic devices requires high conformability and mechanical flexibility. Here, a fast and cost-effective approach for compliant thin-film resistive temperature sensors and thermistors is presented. The fabrication is performed on a heat-shrinkable substrate, allowing the sensors to conform to unconventional and irregular surfaces. The effect of shrinkage on the dimensions and the electrical performance of the devices is analyzed, proving that the heat-induced shrinking process does not compromise the devices' functionality, even when crumpled or wrapped onto irregular surfaces. The thermal response of the shrunk sensors in the temperature range from 25°C to 60°C shows a linear response and stable performance with a sensitivity of 2.2 ×10−3°C−1and 1.8 × 10−2°C−1for resistive sensors and thermistors, respectively, during the heating and cooling processes, suggesting the suitability of this method for the development of highly adaptable sensing devices on complex surfaces.
