%0 Conference Paper %1 conf/icra/BlanzSH87 %A Blanz, Wolf-Ekkehard %A Sanz, Jorge L. C. %A Hinkle, Eric B. %B ICRA %D 1987 %I IEEE %K dblp %P 509-514 %T Image analysis methods for solder ball inspection in integrated circuit manufacturing. %U http://dblp.uni-trier.de/db/conf/icra/icra1987.html#BlanzSH87 %@ 0-8186-0787-4

@inproceedings{conf/icra/BlanzSH87, added-at = {2017-05-22T00:00:00.000+0200}, author = {Blanz, Wolf-Ekkehard and Sanz, Jorge L. C. and Hinkle, Eric B.}, biburl = {https://www.bibsonomy.org/bibtex/28241399cd9f2d068b7a7604383c3b16f/dblp}, booktitle = {ICRA}, crossref = {conf/icra/1987}, ee = {https://doi.org/10.1109/ROBOT.1987.1087990}, interhash = {8d7d241fa863d65cef69ed752f80f443}, intrahash = {8241399cd9f2d068b7a7604383c3b16f}, isbn = {0-8186-0787-4}, keywords = {dblp}, pages = {509-514}, publisher = {IEEE}, timestamp = {2019-10-17T13:14:26.000+0200}, title = {Image analysis methods for solder ball inspection in integrated circuit manufacturing.}, url = {http://dblp.uni-trier.de/db/conf/icra/icra1987.html#BlanzSH87}, year = 1987 }