%0 Conference Paper %1 conf/wacv/KimCMP96 %A Kim, Tae-Hyeon %A Cho, Tai-Hoon %A Moon, Young Shik %A Park, Sung-Han %B WACV %D 1996 %I IEEE Computer Society %K dblp %P 110-115 %T An automated visual inspection of solder joints using 2D and 3D features. %U http://dblp.uni-trier.de/db/conf/wacv/wacv1996.html#KimCMP96 %@ 0-8186-7620-5

@inproceedings{conf/wacv/KimCMP96, added-at = {2023-03-24T00:00:00.000+0100}, author = {Kim, Tae-Hyeon and Cho, Tai-Hoon and Moon, Young Shik and Park, Sung-Han}, biburl = {https://www.bibsonomy.org/bibtex/288bcde0a23dc1ff4983d17e539207e25/dblp}, booktitle = {WACV}, crossref = {conf/wacv/1996}, ee = {https://doi.ieeecomputersociety.org/10.1109/ACV.1996.572013}, interhash = {a2c6cdb2f822cfa63eeb95b8fc108670}, intrahash = {88bcde0a23dc1ff4983d17e539207e25}, isbn = {0-8186-7620-5}, keywords = {dblp}, pages = {110-115}, publisher = {IEEE Computer Society}, timestamp = {2024-04-10T07:17:53.000+0200}, title = {An automated visual inspection of solder joints using 2D and 3D features.}, url = {http://dblp.uni-trier.de/db/conf/wacv/wacv1996.html#KimCMP96}, year = 1996 }