%0 Conference Paper %1 conf/3dic/BeilliardCCMSMSEP13 %A Beilliard, Yann %A Coudrain, Perceval %A Cioccio, Léa Di %A Moreau, Stéphane %A Sanchez, Loic %A Montmayeul, Brigitte %A Signamarcheix, Thomas %A Estevez, Rafael %A Parry, Guillaume %B 3DIC %D 2013 %I IEEE %K dblp %P 1-7 %T Chip to wafer copper direct bonding electrical characterization and thermal cycling. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#BeilliardCCMSMSEP13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/BeilliardCCMSMSEP13, added-at = {2021-01-21T00:00:00.000+0100}, author = {Beilliard, Yann and Coudrain, Perceval and Cioccio, Léa Di and Moreau, Stéphane and Sanchez, Loic and Montmayeul, Brigitte and Signamarcheix, Thomas and Estevez, Rafael and Parry, Guillaume}, biburl = {https://www.bibsonomy.org/bibtex/268b5fc4def5f8dbee2e98fa2a1a1c79a/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702315}, interhash = {2a72826d1512e184956bf456eb6609d5}, intrahash = {68b5fc4def5f8dbee2e98fa2a1a1c79a}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-7}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:52.000+0200}, title = {Chip to wafer copper direct bonding electrical characterization and thermal cycling.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#BeilliardCCMSMSEP13}, year = 2013 }