%0 Journal Article %1 journals/mr/LeongYKIT14 %A Leong, HungYang %A Kar, Yap Boon %A Khan, Navas %A Ibrahim, Mohd Rusli %A Tan, L. C. %D 2014 %J Microelectronics Reliability %K dblp %N 8 %P 1567-1574 %T Insulated Cu wire free air ball characterization. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#LeongYKIT14 %V 54

@article{journals/mr/LeongYKIT14, added-at = {2016-11-25T00:00:00.000+0100}, author = {Leong, HungYang and Kar, Yap Boon and Khan, Navas and Ibrahim, Mohd Rusli and Tan, L. C.}, biburl = {https://www.bibsonomy.org/bibtex/2ad9fd104d4aa1e9bde009068196beef8/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2014.03.015}, interhash = {1423a7723c9695ca6946696bef0089e2}, intrahash = {ad9fd104d4aa1e9bde009068196beef8}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 8, pages = {1567-1574}, timestamp = {2016-11-26T11:33:19.000+0100}, title = {Insulated Cu wire free air ball characterization.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#LeongYKIT14}, volume = 54, year = 2014 }