%0 Journal Article %1 journals/mr/LimBYCGC16 %A Lim, Adeline B. Y. %A Boothroyd, Chris B. %A Yauw, Oranna %A Chylak, Bob %A Gan, Chee Lip %A Chen, Zhong %D 2016 %J Microelectron. Reliab. %K dblp %P 214-223 %T Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution. %U http://dblp.uni-trier.de/db/journals/mr/mr63.html#LimBYCGC16 %V 63

@article{journals/mr/LimBYCGC16, added-at = {2020-02-22T00:00:00.000+0100}, author = {Lim, Adeline B. Y. and Boothroyd, Chris B. and Yauw, Oranna and Chylak, Bob and Gan, Chee Lip and Chen, Zhong}, biburl = {https://www.bibsonomy.org/bibtex/2c802b1b69ed2aa44c1602f9e7f9a7546/dblp}, ee = {https://doi.org/10.1016/j.microrel.2016.04.003}, interhash = {52e3d5c007adac0af98066bf52067117}, intrahash = {c802b1b69ed2aa44c1602f9e7f9a7546}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {214-223}, timestamp = {2020-02-25T13:27:10.000+0100}, title = {Interfacial evolution and bond reliability in thermosonic Pd coated Cu wire bonding on aluminum metallization: Effect of palladium distribution.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr63.html#LimBYCGC16}, volume = 63, year = 2016 }