%0 Journal Article %1 journals/mr/HochstenbachDYZB10 %A Hochstenbach, Hendrik Pieter %A van Driel, Willem D. %A Yang, Dao-Guo %A Zaal, Jeroen J. M. %A Bagerman, E. %D 2010 %J Microelectronics Reliability %K dblp %N 4 %P 528-535 %T Designing for reliability using a new Wafer Level Package structure. %U http://dblp.uni-trier.de/db/journals/mr/mr50.html#HochstenbachDYZB10 %V 50

@article{journals/mr/HochstenbachDYZB10, added-at = {2017-01-27T00:00:00.000+0100}, author = {Hochstenbach, Hendrik Pieter and van Driel, Willem D. and Yang, Dao-Guo and Zaal, Jeroen J. M. and Bagerman, E.}, biburl = {https://www.bibsonomy.org/bibtex/2cc4340e98d0367eb265ec1a889c58b8c/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2009.09.011}, interhash = {cdbb4bb79ce3ce1028ef71ff43d9b8ab}, intrahash = {cc4340e98d0367eb265ec1a889c58b8c}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 4, pages = {528-535}, timestamp = {2017-01-28T11:33:52.000+0100}, title = {Designing for reliability using a new Wafer Level Package structure.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr50.html#HochstenbachDYZB10}, volume = 50, year = 2010 }