%0 Journal Article %1 journals/mr/SuY11 %A Su, Chao-Ton %A Yeh, Cheng-Jung %D 2011 %J Microelectron. Reliab. %K dblp %N 1 %P 53-59 %T Optimization of the Cu wire bonding process for IC assembly using Taguchi methods. %U http://dblp.uni-trier.de/db/journals/mr/mr51.html#SuY11 %V 51

@article{journals/mr/SuY11, added-at = {2020-02-22T00:00:00.000+0100}, author = {Su, Chao-Ton and Yeh, Cheng-Jung}, biburl = {https://www.bibsonomy.org/bibtex/2e12edf8f48037c8dfa7e4d8106442455/dblp}, ee = {https://doi.org/10.1016/j.microrel.2010.09.007}, interhash = {ecec4374ba7c5271e7b4f921b63c9345}, intrahash = {e12edf8f48037c8dfa7e4d8106442455}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 1, pages = {53-59}, timestamp = {2020-02-25T13:23:02.000+0100}, title = {Optimization of the Cu wire bonding process for IC assembly using Taguchi methods.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#SuY11}, volume = 51, year = 2011 }