%0 Journal Article %1 journals/mr/GanH15 %A Gan, Chong Leong %A Hashim, Uda %D 2015 %J Microelectron. Reliab. %K dblp %N 5 %P 852 %T Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online). %U http://dblp.uni-trier.de/db/journals/mr/mr55.html#GanH15 %V 55

@article{journals/mr/GanH15, added-at = {2020-02-22T00:00:00.000+0100}, author = {Gan, Chong Leong and Hashim, Uda}, biburl = {https://www.bibsonomy.org/bibtex/2f14533cd7c1442446b7f7eb2ef09734d/dblp}, ee = {https://doi.org/10.1016/j.microrel.2015.02.010}, interhash = {ea75600e3741367f2f3d2ee6cf3e12fc}, intrahash = {f14533cd7c1442446b7f7eb2ef09734d}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 5, pages = 852, timestamp = {2020-02-25T13:24:54.000+0100}, title = {Fundamentals of Lead-Free Solder Interconnect Technology (from Microstructures to Reliability). Springer (2015). XIII pp. 253, ISBN: 978-1-4614-9265-8 (Print), 978-1-4614-9266-5 (Online).}, url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#GanH15}, volume = 55, year = 2015 }