%0 Journal Article %1 journals/mr/YuanDSSEEKZ06 %A Yuan, Cadmus A. %A van Driel, Willem D. %A van Silfhout, Richard B. R. %A van der Sluis, Olaf %A Engelen, Roy A. B. %A Ernst, Leo J. %A van Keulen, Fred %A Zhang, G. Q. %D 2006 %J Microelectron. Reliab. %K dblp %N 9-11 %P 1679-1684 %T Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. %U http://dblp.uni-trier.de/db/journals/mr/mr46.html#YuanDSSEEKZ06 %V 46

@article{journals/mr/YuanDSSEEKZ06, added-at = {2023-09-30T00:00:00.000+0200}, author = {Yuan, Cadmus A. and van Driel, Willem D. and van Silfhout, Richard B. R. and van der Sluis, Olaf and Engelen, Roy A. B. and Ernst, Leo J. and van Keulen, Fred and Zhang, G. Q.}, biburl = {https://www.bibsonomy.org/bibtex/2f1ff4c0b2c1299f2adc7dc82ddb3b6d6/dblp}, ee = {https://doi.org/10.1016/j.microrel.2006.07.054}, interhash = {80ac80eea67538dc075a2e4e97ba4d34}, intrahash = {f1ff4c0b2c1299f2adc7dc82ddb3b6d6}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = {9-11}, pages = {1679-1684}, timestamp = {2024-04-09T02:49:20.000+0200}, title = {Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr46.html#YuanDSSEEKZ06}, volume = 46, year = 2006 }