%0 Conference Paper %1 conf/irps/LeeBMFTK15 %A Lee, Kang Wook %A Bea, Ji Chel %A Murugesan, Mariappan %A Fukushima, Takafumi %A Tanaka, Tetsu %A Koyanagi, Mitsumasa %B IRPS %D 2015 %I IEEE %K dblp %P 4 %T Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM. %U http://dblp.uni-trier.de/db/conf/irps/irps2015.html#LeeBMFTK15 %@ 978-1-4673-7362-3

@inproceedings{conf/irps/LeeBMFTK15, added-at = {2021-02-16T00:00:00.000+0100}, author = {Lee, Kang Wook and Bea, Ji Chel and Murugesan, Mariappan and Fukushima, Takafumi and Tanaka, Tetsu and Koyanagi, Mitsumasa}, biburl = {https://www.bibsonomy.org/bibtex/2c2f32f58f86f998956bc1376e8b9ca84/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2015}, ee = {https://doi.org/10.1109/IRPS.2015.7112733}, interhash = {2ffc43949dea1f508e726397f0bf3683}, intrahash = {c2f32f58f86f998956bc1376e8b9ca84}, isbn = {978-1-4673-7362-3}, keywords = {dblp}, pages = 4, publisher = {IEEE}, timestamp = {2024-04-10T16:54:51.000+0200}, title = {Impacts of 3-D integration processes on device reliabilities in thinned DRAM chip for 3-D DRAM.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2015.html#LeeBMFTK15}, year = 2015 }