Please log in to take part in the discussion (add own reviews or comments).
Cite this publication
More citation styles
- please select -
%0 Journal Article
%1 journals/micromachines/FukushimaHYKMBL16
%A Fukushima, Takafumi
%A Hashiguchi, Hideto
%A Yonekura, Hiroshi
%A Kino, Hisashi
%A Murugesan, Mariappan
%A Bea, Ji Chel
%A Lee, Kang Wook
%A Tanaka, Tetsu
%A Koyanagi, Mitsumasa
%D 2016
%J Micromachines
%K dblp
%N 10
%P 184
%T Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.
%U http://dblp.uni-trier.de/db/journals/micromachines/micromachines7.html#FukushimaHYKMBL16
%V 7
@article{journals/micromachines/FukushimaHYKMBL16,
added-at = {2021-10-14T00:00:00.000+0200},
author = {Fukushima, Takafumi and Hashiguchi, Hideto and Yonekura, Hiroshi and Kino, Hisashi and Murugesan, Mariappan and Bea, Ji Chel and Lee, Kang Wook and Tanaka, Tetsu and Koyanagi, Mitsumasa},
biburl = {https://www.bibsonomy.org/bibtex/22d90ce1e4812cd9433b896535aa23103/dblp},
ee = {https://www.wikidata.org/entity/Q92888473},
interhash = {300d3f7d1290341e4d6f5dda104ebc97},
intrahash = {2d90ce1e4812cd9433b896535aa23103},
journal = {Micromachines},
keywords = {dblp},
number = 10,
pages = 184,
timestamp = {2024-04-08T19:44:12.000+0200},
title = {Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.},
url = {http://dblp.uni-trier.de/db/journals/micromachines/micromachines7.html#FukushimaHYKMBL16},
volume = 7,
year = 2016
}
