Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology.
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%0 Journal Article
%1 journals/simpra/AzizAKA15
%A Aziz, M. S. Abdul
%A Abdullah, Mohd Zulkifly
%A Khor, C. Y.
%A Azid, I. A.
%D 2015
%J Simul. Model. Pract. Theory
%K dblp
%P 45-57
%T Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology.
%U http://dblp.uni-trier.de/db/journals/simpra/simpra57.html#AzizAKA15
%V 57
@article{journals/simpra/AzizAKA15,
added-at = {2020-02-24T00:00:00.000+0100},
author = {Aziz, M. S. Abdul and Abdullah, Mohd Zulkifly and Khor, C. Y. and Azid, I. A.},
biburl = {https://www.bibsonomy.org/bibtex/20678102eea411da0dc891a0cd7974999/dblp},
ee = {https://doi.org/10.1016/j.simpat.2015.06.001},
interhash = {31841cca47885cfef16a7cbfdc136eb6},
intrahash = {0678102eea411da0dc891a0cd7974999},
journal = {Simul. Model. Pract. Theory},
keywords = {dblp},
pages = {45-57},
timestamp = {2020-02-25T13:37:25.000+0100},
title = {Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology.},
url = {http://dblp.uni-trier.de/db/journals/simpra/simpra57.html#AzizAKA15},
volume = 57,
year = 2015
}
