Inproceedings,
Integration of intra chip stack fluidic cooling using thin-layer solder bonding.
Y. Madhour, M. Zervas, G. Schlottig, T. Brunschwiler, Y. Leblebici, J. Thome, and B. Michel.3DIC, page 1-8. IEEE, (2013)
Meta data
- BibTeX key
- conf/3dic/MadhourZSBLTM13
- entry type
- inproceedings
- booktitle
- 3DIC
- year
- 2013
- pages
- 1-8
- publisher
- IEEE
- crossref
- conf/3dic/2013
- ee
- https://doi.org/10.1109/3DIC.2013.6702343
- isbn
- 978-1-4673-6484-3
- url
- http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#MadhourZSBLTM13
Tags
Users
Comments and Reviewsshow / hide
Cite this publication
More citation styles
- please select -%0 Conference Paper
%1 conf/3dic/MadhourZSBLTM13
%A Madhour, Yassir
%A Zervas, Michael
%A Schlottig, Gerd
%A Brunschwiler, Thomas
%A Leblebici, Yusuf
%A Thome, John Richard
%A Michel, Bruno
%B 3DIC
%D 2013
%I IEEE
%K dblp
%P 1-8
%T Integration of intra chip stack fluidic cooling using thin-layer solder bonding.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#MadhourZSBLTM13
%@ 978-1-4673-6484-3
@inproceedings{conf/3dic/MadhourZSBLTM13,
added-at = {2017-05-21T00:00:00.000+0200},
author = {Madhour, Yassir and Zervas, Michael and Schlottig, Gerd and Brunschwiler, Thomas and Leblebici, Yusuf and Thome, John Richard and Michel, Bruno},
biburl = {https://www.bibsonomy.org/bibtex/28011e13aff7a8f0f8b54a1e6942f073c/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2013},
ee = {https://doi.org/10.1109/3DIC.2013.6702343},
interhash = {3afb9409463fe27758564ea0b7f247c0},
intrahash = {8011e13aff7a8f0f8b54a1e6942f073c},
isbn = {978-1-4673-6484-3},
keywords = {dblp},
pages = {1-8},
publisher = {IEEE},
timestamp = {2019-10-17T15:31:37.000+0200},
title = {Integration of intra chip stack fluidic cooling using thin-layer solder bonding.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#MadhourZSBLTM13},
year = 2013
}