%0 Conference Paper %1 conf/chi/HoffmannEMWM23 %A Hoffmann, Philipp Pascal %A Elsayed, Hesham %A Mühlhäuser, Max %A Wehbe, Rina R. %A Machuca, Mayra Donaji Barrera %B CHI Extended Abstracts %D 2023 %E Schmidt, Albrecht %E Väänänen, Kaisa %E Goyal, Tesh %E Kristensson, Per Ola %E Peters, Anicia %I ACM %K dblp %P 474:1-474:4 %T ThermalPen: Adding Thermal Haptic Feedback to 3D Sketching. %U http://dblp.uni-trier.de/db/conf/chi/chi2023a.html#HoffmannEMWM23 %@ 978-1-4503-9422-2

@inproceedings{conf/chi/HoffmannEMWM23, added-at = {2023-04-29T00:00:00.000+0200}, author = {Hoffmann, Philipp Pascal and Elsayed, Hesham and Mühlhäuser, Max and Wehbe, Rina R. and Machuca, Mayra Donaji Barrera}, biburl = {https://www.bibsonomy.org/bibtex/2410a4d0a462bbf711830dc1b969ce080/dblp}, booktitle = {CHI Extended Abstracts}, crossref = {conf/chi/2023a}, editor = {Schmidt, Albrecht and Väänänen, Kaisa and Goyal, Tesh and Kristensson, Per Ola and Peters, Anicia}, ee = {https://doi.org/10.1145/3544549.3583901}, interhash = {468eeb423206e1bbdee6b33389e70d46}, intrahash = {410a4d0a462bbf711830dc1b969ce080}, isbn = {978-1-4503-9422-2}, keywords = {dblp}, pages = {474:1-474:4}, publisher = {ACM}, timestamp = {2024-04-09T18:28:08.000+0200}, title = {ThermalPen: Adding Thermal Haptic Feedback to 3D Sketching.}, url = {http://dblp.uni-trier.de/db/conf/chi/chi2023a.html#HoffmannEMWM23}, year = 2023 }