%0 Conference Paper %1 conf/3dic/NadipalliFLWYT11 %A Nadipalli, Revanth %A Fan, Ji %A Li, Holden King Ho %A Wee, Keng Hoong %A Yu, Hao %A Tan, Chuan Seng %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K dblp %P 1-5 %T 3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#NadipalliFLWYT11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/NadipalliFLWYT11, added-at = {2022-04-19T00:00:00.000+0200}, author = {Nadipalli, Revanth and Fan, Ji and Li, Holden King Ho and Wee, Keng Hoong and Yu, Hao and Tan, Chuan Seng}, biburl = {https://www.bibsonomy.org/bibtex/2cfa8579252dec4e8c3527e76b1831a05/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {https://doi.org/10.1109/3DIC.2012.6262956}, interhash = {5b524949cf7e80f341408b6f4aebaa5c}, intrahash = {cfa8579252dec4e8c3527e76b1831a05}, isbn = {978-1-4673-2189-1}, keywords = {dblp}, pages = {1-5}, publisher = {IEEE}, timestamp = {2024-04-10T12:11:22.000+0200}, title = {3D integration of MEMS and CMOS via Cu-Cu bonding with simultaneous formation of electrical, mechanical and hermetic bonds.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#NadipalliFLWYT11}, year = 2011 }