%0 Journal Article %1 journals/mr/KhooTV03 %A Khoo, Sherry Suat Cheng %A Tan, Pee Ya %A Voldman, Steven H. %D 2003 %J Microelectron. Reliab. %K dblp %N 7 %P 1039-1045 %T Microanalysis and electromigration reliability performance of high current transmission line pulse (TLP) stressed copper interconnects. %U http://dblp.uni-trier.de/db/journals/mr/mr43.html#KhooTV03 %V 43

@article{journals/mr/KhooTV03, added-at = {2020-02-22T00:00:00.000+0100}, author = {Khoo, Sherry Suat Cheng and Tan, Pee Ya and Voldman, Steven H.}, biburl = {https://www.bibsonomy.org/bibtex/236a9808e8de4e6c349451818f8c55b12/dblp}, ee = {https://doi.org/10.1016/S0026-2714(03)00133-1}, interhash = {6013dbc1e6373ad0986c8e715305b17a}, intrahash = {36a9808e8de4e6c349451818f8c55b12}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 7, pages = {1039-1045}, timestamp = {2020-02-25T13:24:46.000+0100}, title = {Microanalysis and electromigration reliability performance of high current transmission line pulse (TLP) stressed copper interconnects.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr43.html#KhooTV03}, volume = 43, year = 2003 }