%0 Conference Paper %1 conf/3dic/KondoMYO15 %A Kondo, Kazuo %A Mukahara, Shingo %A Yokoi, Masayuki %A Onuki, Jin %B 3DIC %D 2015 %I IEEE %K dblp %P TS4.1.1-TS4.1.4 %T No pumping at 450°C with electrodeposited copper TSV. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#KondoMYO15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/KondoMYO15, added-at = {2017-05-21T00:00:00.000+0200}, author = {Kondo, Kazuo and Mukahara, Shingo and Yokoi, Masayuki and Onuki, Jin}, biburl = {https://www.bibsonomy.org/bibtex/27ba8c7a4e45d046399f9cf5d7bbabcb8/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334559}, interhash = {714c22483c4967680378b7f89f015c0d}, intrahash = {7ba8c7a4e45d046399f9cf5d7bbabcb8}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS4.1.1-TS4.1.4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {No pumping at 450°C with electrodeposited copper TSV.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#KondoMYO15}, year = 2015 }