%0 Conference Paper %1 conf/reconfig/FusiaraSPHKSH18 %A Fusiara, Paulina %A Schoonderbeek, Gijs %A Pragt, Johan %A Hiemstra, Leon %A Kuindersma, Sjouke %A Schuil, Menno %A Hampson, Grant %B ReConFig %D 2018 %E Andrews, David %E Cumplido, René %E Feregrino, Claudia %E Stroobandt, Dirk %I IEEE %K dblp %P 1-8 %T Design and Fabrication of Full Board Direct Liquid Cooling Heat Sink for Densely Packed FPGA Processing Boards. %U http://dblp.uni-trier.de/db/conf/reconfig/reconfig2018.html#FusiaraSPHKSH18 %@ 978-1-7281-1968-7

@inproceedings{conf/reconfig/FusiaraSPHKSH18, added-at = {2019-02-17T00:00:00.000+0100}, author = {Fusiara, Paulina and Schoonderbeek, Gijs and Pragt, Johan and Hiemstra, Leon and Kuindersma, Sjouke and Schuil, Menno and Hampson, Grant}, biburl = {https://www.bibsonomy.org/bibtex/2128c8039d0c103be7c89ef545060dc34/dblp}, booktitle = {ReConFig}, crossref = {conf/reconfig/2018}, editor = {Andrews, David and Cumplido, René and Feregrino, Claudia and Stroobandt, Dirk}, ee = {https://doi.org/10.1109/RECONFIG.2018.8641727}, interhash = {7de2d2135cac9ba4c45410ee4f160f02}, intrahash = {128c8039d0c103be7c89ef545060dc34}, isbn = {978-1-7281-1968-7}, keywords = {dblp}, pages = {1-8}, publisher = {IEEE}, timestamp = {2019-10-17T15:40:56.000+0200}, title = {Design and Fabrication of Full Board Direct Liquid Cooling Heat Sink for Densely Packed FPGA Processing Boards.}, url = {http://dblp.uni-trier.de/db/conf/reconfig/reconfig2018.html#FusiaraSPHKSH18}, year = 2018 }