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%0 Conference Paper
%1 conf/iscas/AfonsoSASCPZA17
%A Afonso, Vladimir
%A Susin, Altamiro Amadeu
%A Audibert, Luan
%A Saldanha, Mário
%A Conceicao, Ruhan
%A Porto, Marcelo Schiavon
%A Zatt, Bruno
%A Agostini, Luciano Volcan
%B ISCAS
%D 2017
%I IEEE
%K dblp
%P 1-4
%T Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip.
%U http://dblp.uni-trier.de/db/conf/iscas/iscas2017.html#AfonsoSASCPZA17
%@ 978-1-4673-6853-7
@inproceedings{conf/iscas/AfonsoSASCPZA17,
added-at = {2018-11-02T00:00:00.000+0100},
author = {Afonso, Vladimir and Susin, Altamiro Amadeu and Audibert, Luan and Saldanha, Mário and Conceicao, Ruhan and Porto, Marcelo Schiavon and Zatt, Bruno and Agostini, Luciano Volcan},
biburl = {https://www.bibsonomy.org/bibtex/29781871c82d8edd3b08364dea2daf2f4/dblp},
booktitle = {ISCAS},
crossref = {conf/iscas/2017},
ee = {https://doi.org/10.1109/ISCAS.2017.8050463},
interhash = {7e3997fc7580ff146b25d8058e65e99e},
intrahash = {9781871c82d8edd3b08364dea2daf2f4},
isbn = {978-1-4673-6853-7},
keywords = {dblp},
pages = {1-4},
publisher = {IEEE},
timestamp = {2018-11-03T15:20:41.000+0100},
title = {Low-power and high-throughput hardware design for the 3D-HEVC depth intra skip.},
url = {http://dblp.uni-trier.de/db/conf/iscas/iscas2017.html#AfonsoSASCPZA17},
year = 2017
}