%0 Conference Paper %1 conf/3dic/LeeNNABKHFT15 %A Lee, K. W. %A Nagai, Chisato %A Nakamura, Ai %A Aizawa, Hiroki %A Bea, Ji Chel %A Koyanagi, Mitsumasa %A Hashiguchi, Hideto %A Fukushima, Takafumi %A Tanaka, Tanaka %B 3DIC %D 2015 %I IEEE %K dblp %P TS1.2.1-TS1.2.4 %T Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#LeeNNABKHFT15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/LeeNNABKHFT15, added-at = {2021-09-06T00:00:00.000+0200}, author = {Lee, K. W. and Nagai, Chisato and Nakamura, Ai and Aizawa, Hiroki and Bea, Ji Chel and Koyanagi, Mitsumasa and Hashiguchi, Hideto and Fukushima, Takafumi and Tanaka, Tanaka}, biburl = {https://www.bibsonomy.org/bibtex/201a8cd745c8b97ffd369dc1751220716/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334471}, interhash = {825735d57d2a04ce56c3920c77e5345f}, intrahash = {01a8cd745c8b97ffd369dc1751220716}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS1.2.1-TS1.2.4}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:59.000+0200}, title = {Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#LeeNNABKHFT15}, year = 2015 }