%0 Journal Article %1 journals/mr/AuerspergDJBRM14 %A Auersperg, Jürgen %A Dudek, Rainer %A Jordan, R. %A Bochow-Neß, O. %A Rzepka, Sven %A Michel, Bernd %D 2014 %J Microelectron. Reliab. %K dblp %N 6-7 %P 1223-1227 %T On the crack and delamination risk optimization of a Si-interposer for LED packaging. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#AuerspergDJBRM14 %V 54

@article{journals/mr/AuerspergDJBRM14, added-at = {2022-10-02T00:00:00.000+0200}, author = {Auersperg, Jürgen and Dudek, Rainer and Jordan, R. and Bochow-Neß, O. and Rzepka, Sven and Michel, Bernd}, biburl = {https://www.bibsonomy.org/bibtex/2817c05792c59d1a65f993640e20e6204/dblp}, ee = {https://doi.org/10.1016/j.microrel.2014.02.018}, interhash = {84646189a1c81cc856f402cbe3ddbf3e}, intrahash = {817c05792c59d1a65f993640e20e6204}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = {6-7}, pages = {1223-1227}, timestamp = {2024-04-09T02:50:29.000+0200}, title = {On the crack and delamination risk optimization of a Si-interposer for LED packaging.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#AuerspergDJBRM14}, volume = 54, year = 2014 }