%0 Journal Article %1 journals/mr/KaoCLC14 %A Kao, Chin-Li %A Chen, Tei-Chen %A Lai, Yi-Shao %A Chiu, Ying-Ta %D 2014 %J Microelectron. Reliab. %K dblp %N 11 %P 2471-2478 %T Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#KaoCLC14 %V 54

@article{journals/mr/KaoCLC14, added-at = {2020-02-22T00:00:00.000+0100}, author = {Kao, Chin-Li and Chen, Tei-Chen and Lai, Yi-Shao and Chiu, Ying-Ta}, biburl = {https://www.bibsonomy.org/bibtex/2ce3e28d25371bc33baf956abb02b194a/dblp}, ee = {https://doi.org/10.1016/j.microrel.2014.04.014}, interhash = {84a1b6e3fa09836c3d0dd1e3b28fe2ee}, intrahash = {ce3e28d25371bc33baf956abb02b194a}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 11, pages = {2471-2478}, timestamp = {2020-02-25T13:29:10.000+0100}, title = {Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#KaoCLC14}, volume = 54, year = 2014 }