%0 Conference Paper %1 conf/3dic/JouveSGDCAABDFC15 %A Jouve, Amadine %A Sinquin, Y. %A Garnier, Arnaud %A Daval, M. %A Chausse, Pascal %A Argoud, M. %A Allouti, N. %A Baud, Laurence %A Dechamp, Jérôme %A Franiatte, R. %A Cheramy, Séverine %A Kato, H. %A Kondo, K. %B 3DIC %D 2015 %I IEEE %K dblp %P TS1.4.1-TS1.4.8 %T Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#JouveSGDCAABDFC15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/JouveSGDCAABDFC15, added-at = {2017-05-21T00:00:00.000+0200}, author = {Jouve, Amadine and Sinquin, Y. and Garnier, Arnaud and Daval, M. and Chausse, Pascal and Argoud, M. and Allouti, N. and Baud, Laurence and Dechamp, Jérôme and Franiatte, R. and Cheramy, Séverine and Kato, H. and Kondo, K.}, biburl = {https://www.bibsonomy.org/bibtex/26b778ff1c98771974a50a970dd134e05/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334553}, interhash = {89bfede8bd33539bc554af8c96eb937b}, intrahash = {6b778ff1c98771974a50a970dd134e05}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS1.4.1-TS1.4.8}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#JouveSGDCAABDFC15}, year = 2015 }