%0 Journal Article %1 journals/mr/YehL08 %A Yeh, Chang-Lin %A Lai, Yi-Shao %D 2008 %J Microelectron. Reliab. %K dblp %N 2 %P 282-292 %T Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops. %U http://dblp.uni-trier.de/db/journals/mr/mr48.html#YehL08 %V 48

@article{journals/mr/YehL08, added-at = {2020-02-22T00:00:00.000+0100}, author = {Yeh, Chang-Lin and Lai, Yi-Shao}, biburl = {https://www.bibsonomy.org/bibtex/2e2d935efca6a00786ef9415b97110abf/dblp}, ee = {https://doi.org/10.1016/j.microrel.2007.04.017}, interhash = {8acaf0372f06ed5fe75022f9a922e096}, intrahash = {e2d935efca6a00786ef9415b97110abf}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 2, pages = {282-292}, timestamp = {2020-02-25T13:29:10.000+0100}, title = {Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr48.html#YehL08}, volume = 48, year = 2008 }