%0 Journal Article %1 journals/mr/MartensKMVW08 %A Martens, Stefan %A Krueger, B. %A Mack, Walter %A Voelklein, Friedemann %A Wilde, Jürgen %D 2008 %J Microelectron. Reliab. %K dblp %N 8-9 %P 1513-1516 %T Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting. %U http://dblp.uni-trier.de/db/journals/mr/mr48.html#MartensKMVW08 %V 48

@article{journals/mr/MartensKMVW08, added-at = {2021-08-03T00:00:00.000+0200}, author = {Martens, Stefan and Krueger, B. and Mack, Walter and Voelklein, Friedemann and Wilde, Jürgen}, biburl = {https://www.bibsonomy.org/bibtex/21bdbd90b4664a704ce499604807dfa8b/dblp}, ee = {https://doi.org/10.1016/j.microrel.2008.06.033}, interhash = {8fc250ade87b398ac33304e089e1c98c}, intrahash = {1bdbd90b4664a704ce499604807dfa8b}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = {8-9}, pages = {1513-1516}, timestamp = {2024-04-09T02:49:59.000+0200}, title = {Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr48.html#MartensKMVW08}, volume = 48, year = 2008 }