%0 Conference Paper %1 conf/3dic/IkedaQNA13 %A Ikeda, Akihiro %A Qiu, L. J. %A Nakahara, K. %A Asano, Tanemasa %B 3DIC %D 2013 %I IEEE %K dblp %P 1-4 %T Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#IkedaQNA13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/IkedaQNA13, added-at = {2019-06-07T00:00:00.000+0200}, author = {Ikeda, Akihiro and Qiu, L. J. and Nakahara, K. and Asano, Tanemasa}, biburl = {https://www.bibsonomy.org/bibtex/2bfbbeded0dcfda7ade6dbfd7c606ba86/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702317}, interhash = {912757ed1d60d326bd39868cc97d908e}, intrahash = {bfbbeded0dcfda7ade6dbfd7c606ba86}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#IkedaQNA13}, year = 2013 }