%0 Conference Paper %1 conf/ddecs/GerakisALH14 %A Gerakis, Vasileios %A Avdikou, Christina %A Liolios, Alexandros %A Hatzopoulos, Alkis A. %B DDECS %D 2014 %I IEEE Computer Society %K dblp %P 310-313 %T Modeling and analysis of cracked through silicon via (TSV) interconnections. %U http://dblp.uni-trier.de/db/conf/ddecs/ddecs2014.html#GerakisALH14 %@ 978-1-4799-4560-3

@inproceedings{conf/ddecs/GerakisALH14, added-at = {2023-03-24T00:00:00.000+0100}, author = {Gerakis, Vasileios and Avdikou, Christina and Liolios, Alexandros and Hatzopoulos, Alkis A.}, biburl = {https://www.bibsonomy.org/bibtex/229bbe247f72483222f0dd87fdcfa3f3c/dblp}, booktitle = {DDECS}, crossref = {conf/ddecs/2014}, ee = {https://doi.ieeecomputersociety.org/10.1109/DDECS.2014.6868817}, interhash = {9e177527a783c852c4a11c4765e127fd}, intrahash = {29bbe247f72483222f0dd87fdcfa3f3c}, isbn = {978-1-4799-4560-3}, keywords = {dblp}, pages = {310-313}, publisher = {IEEE Computer Society}, timestamp = {2024-04-10T06:41:20.000+0200}, title = {Modeling and analysis of cracked through silicon via (TSV) interconnections.}, url = {http://dblp.uni-trier.de/db/conf/ddecs/ddecs2014.html#GerakisALH14}, year = 2014 }