Please log in to take part in the discussion (add own reviews or comments).
Cite this publication
More citation styles
- please select -
%0 Conference Paper
%1 conf/3dic/CivaleMJFYWKRL13
%A Civale, Yann
%A Meynen, Herman
%A John, Ranjith S. E.
%A Fu, Peng-Fei
%A Yeakle, Craig R.
%A Wang, Sheng
%A Krausse, Stefan
%A Rapps, Thomas
%A Lutter, Stefan
%B 3DIC
%D 2013
%I IEEE
%K dblp
%P 1-5
%T Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#CivaleMJFYWKRL13
%@ 978-1-4673-6484-3
@inproceedings{conf/3dic/CivaleMJFYWKRL13,
added-at = {2017-05-21T00:00:00.000+0200},
author = {Civale, Yann and Meynen, Herman and John, Ranjith S. E. and Fu, Peng-Fei and Yeakle, Craig R. and Wang, Sheng and Krausse, Stefan and Rapps, Thomas and Lutter, Stefan},
biburl = {https://www.bibsonomy.org/bibtex/22a55c30372ef79535ec98eaa50e76b49/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2013},
ee = {https://doi.org/10.1109/3DIC.2013.6702330},
interhash = {9e8dbaddd3e5ef5a5b6ff50aac5cf035},
intrahash = {2a55c30372ef79535ec98eaa50e76b49},
isbn = {978-1-4673-6484-3},
keywords = {dblp},
pages = {1-5},
publisher = {IEEE},
timestamp = {2019-10-17T15:31:37.000+0200},
title = {Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#CivaleMJFYWKRL13},
year = 2013
}