%0 Conference Paper %1 conf/3dic/MoriOWISIOMKHTK13 %A Mori, Kentaro %A Ono, Yoshihiro %A Watanabe, Shinji %A Ishikawa, Toshikazu %A Sugiyama, Michiaki %A Imasu, Satoshi %A Ochiai, Toshihiko %A Mori, Ryo %A Kida, Tsuyoshi %A Hashimoto, Tomoaki %A Tanaka, Hideki %A Kimura, Michitaka %B 3DIC %D 2013 %I IEEE %K dblp %P 1-7 %T High density and reliable packaging technology with Non Conductive Film for 3D/TSV. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#MoriOWISIOMKHTK13 %@ 978-1-4673-6484-3

@inproceedings{conf/3dic/MoriOWISIOMKHTK13, added-at = {2017-05-21T00:00:00.000+0200}, author = {Mori, Kentaro and Ono, Yoshihiro and Watanabe, Shinji and Ishikawa, Toshikazu and Sugiyama, Michiaki and Imasu, Satoshi and Ochiai, Toshihiko and Mori, Ryo and Kida, Tsuyoshi and Hashimoto, Tomoaki and Tanaka, Hideki and Kimura, Michitaka}, biburl = {https://www.bibsonomy.org/bibtex/25e95bf7eadfd0b0faaeac3341a5d430c/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2013}, ee = {https://doi.org/10.1109/3DIC.2013.6702322}, interhash = {b9e8abac2ac551b68a54ac6d8b079bf8}, intrahash = {5e95bf7eadfd0b0faaeac3341a5d430c}, isbn = {978-1-4673-6484-3}, keywords = {dblp}, pages = {1-7}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:37.000+0200}, title = {High density and reliable packaging technology with Non Conductive Film for 3D/TSV.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2013.html#MoriOWISIOMKHTK13}, year = 2013 }