%0 Journal Article %1 journals/sensors/MatsumaeKKTHHT22 %A Matsumae, Takashi %A Kariya, Shingo %A Kurashima, Yuichi %A Thu, Le Hac Huong %A Higurashi, Eiji %A Hayase, Masanori %A Takagi, Hideki %D 2022 %J Sensors %K dblp %N 21 %P 8144 %T Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging. %U http://dblp.uni-trier.de/db/journals/sensors/sensors22.html#MatsumaeKKTHHT22 %V 22

@article{journals/sensors/MatsumaeKKTHHT22, added-at = {2022-12-05T00:00:00.000+0100}, author = {Matsumae, Takashi and Kariya, Shingo and Kurashima, Yuichi and Thu, Le Hac Huong and Higurashi, Eiji and Hayase, Masanori and Takagi, Hideki}, biburl = {https://www.bibsonomy.org/bibtex/2ec31cead88498328ac70aa2939b4ad79/dblp}, ee = {https://doi.org/10.3390/s22218144}, interhash = {d09244cedc60ab1685cb1ec51a3d4a4c}, intrahash = {ec31cead88498328ac70aa2939b4ad79}, journal = {Sensors}, keywords = {dblp}, number = 21, pages = 8144, timestamp = {2024-04-09T04:32:25.000+0200}, title = {Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging.}, url = {http://dblp.uni-trier.de/db/journals/sensors/sensors22.html#MatsumaeKKTHHT22}, volume = 22, year = 2022 }