%0 Journal Article %1 journals/mr/TohmyohIWKN13 %A Tohmyoh, Hironori %A Ishikawa, Shoho %A Watanabe, Satoshi %A Kuroha, Motohisa %A Nakano, Yoshikatsu %D 2013 %J Microelectron. Reliab. %K dblp %N 2 %P 314-320 %T Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling. %U http://dblp.uni-trier.de/db/journals/mr/mr53.html#TohmyohIWKN13 %V 53

@article{journals/mr/TohmyohIWKN13, added-at = {2020-02-22T00:00:00.000+0100}, author = {Tohmyoh, Hironori and Ishikawa, Shoho and Watanabe, Satoshi and Kuroha, Motohisa and Nakano, Yoshikatsu}, biburl = {https://www.bibsonomy.org/bibtex/22512503d889d0b393db980a4f3a19a1b/dblp}, ee = {https://doi.org/10.1016/j.microrel.2012.08.012}, interhash = {d8b15db2cfa12f5599b54184dec03cfb}, intrahash = {2512503d889d0b393db980a4f3a19a1b}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 2, pages = {314-320}, timestamp = {2020-02-25T13:25:23.000+0100}, title = {Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr53.html#TohmyohIWKN13}, volume = 53, year = 2013 }