%0 Conference Paper %1 conf/3dic/KimPMBBL15 %A Kim, Soon-Wook %A Peng, Lan %A Miller, Andy %A Beyer, Gerald %A Beyne, Eric %A Lee, Chung-Sun %B 3DIC %D 2015 %I IEEE %K dblp %P TS7.2.1-TS7.2.4 %T Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#KimPMBBL15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/KimPMBBL15, added-at = {2021-10-14T00:00:00.000+0200}, author = {Kim, Soon-Wook and Peng, Lan and Miller, Andy and Beyer, Gerald and Beyne, Eric and Lee, Chung-Sun}, biburl = {https://www.bibsonomy.org/bibtex/23b265810e455a6ac36e8cdec72b71815/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334576}, interhash = {db9f79ea7920ba22c3ed110b3883acb3}, intrahash = {3b265810e455a6ac36e8cdec72b71815}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS7.2.1-TS7.2.4}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:59.000+0200}, title = {Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#KimPMBBL15}, year = 2015 }