%0 Journal Article %1 journals/mr/BrinckerSEP17 %A Brincker, Mads %A Söhl, S. %A Eisele, R. %A Popok, Vladimir N. %D 2017 %J Microelectron. Reliab. %K dblp %P 378-382 %T Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects. %U http://dblp.uni-trier.de/db/journals/mr/mr76.html#BrinckerSEP17 %V 76-77

@article{journals/mr/BrinckerSEP17, added-at = {2020-02-22T00:00:00.000+0100}, author = {Brincker, Mads and Söhl, S. and Eisele, R. and Popok, Vladimir N.}, biburl = {https://www.bibsonomy.org/bibtex/200c529971143019c662ea0113c78ce58/dblp}, ee = {https://doi.org/10.1016/j.microrel.2017.06.041}, interhash = {dedc5aee465029e9b30c42e94caf93ad}, intrahash = {00c529971143019c662ea0113c78ce58}, journal = {Microelectron. Reliab.}, keywords = {dblp}, pages = {378-382}, timestamp = {2020-02-25T13:27:47.000+0100}, title = {Strength and reliability of low temperature transient liquid phase bonded Cu-Sn-Cu interconnects.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr76.html#BrinckerSEP17}, volume = {76-77}, year = 2017 }