%0 Conference Paper %1 conf/3dic/BlasaMMLPHY16 %A Blasa, Reynard %A Mattis, Brian %A Martini, Dave %A Lanee, Sidi %A Petteway, Carl %A Hong, Sangki %A Yi, Kangsoo %B 3DIC %D 2016 %I IEEE %K dblp %P 1-4 %T High density backside tungsten TSV for 3D stacked ICs. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#BlasaMMLPHY16 %@ 978-1-5090-1399-9

@inproceedings{conf/3dic/BlasaMMLPHY16, added-at = {2017-07-13T00:00:00.000+0200}, author = {Blasa, Reynard and Mattis, Brian and Martini, Dave and Lanee, Sidi and Petteway, Carl and Hong, Sangki and Yi, Kangsoo}, biburl = {https://www.bibsonomy.org/bibtex/21d9b18ad2c5bcaa77982676a9a224948/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2016}, ee = {https://doi.org/10.1109/3DIC.2016.7970020}, interhash = {e352f0baccae22832b9f40e7973e90b3}, intrahash = {1d9b18ad2c5bcaa77982676a9a224948}, isbn = {978-1-5090-1399-9}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2019-10-17T15:31:46.000+0200}, title = {High density backside tungsten TSV for 3D stacked ICs.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2016.html#BlasaMMLPHY16}, year = 2016 }