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%0 Conference Paper
%1 conf/3dic/VosCDWSDPB14
%A Vos, Joeri De
%A Cherman, Vladimir
%A Detalle, Mikael
%A Wang, Teng
%A Salahouelhadj, Abdellah
%A Daily, Robert
%A der Plas, Geert Van
%A Beyne, Eric
%B 3DIC
%D 2014
%I IEEE
%K dblp
%P 1-7
%T Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#VosCDWSDPB14
%@ 978-1-4799-8472-5
@inproceedings{conf/3dic/VosCDWSDPB14,
added-at = {2021-10-14T00:00:00.000+0200},
author = {Vos, Joeri De and Cherman, Vladimir and Detalle, Mikael and Wang, Teng and Salahouelhadj, Abdellah and Daily, Robert and der Plas, Geert Van and Beyne, Eric},
biburl = {https://www.bibsonomy.org/bibtex/26a57952769a8d533fde0e6a97f85067b/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2014},
ee = {https://doi.org/10.1109/3DIC.2014.7152146},
interhash = {e73066cc607549088f17b1cfb83099ba},
intrahash = {6a57952769a8d533fde0e6a97f85067b},
isbn = {978-1-4799-8472-5},
keywords = {dblp},
pages = {1-7},
publisher = {IEEE},
timestamp = {2024-04-10T12:10:53.000+0200},
title = {Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2014.html#VosCDWSDPB14},
year = 2014
}