%0 Journal Article %1 journals/mr/YuSKKYS08 %A Yu, Qiang %A Shibutani, Tadahiro %A Kim, Do-Seop %A Kobayashi, Yusuke %A Yang, Jidong %A Shiratori, Masaki %D 2008 %J Microelectron. Reliab. %K dblp %N 3 %P 431-437 %T Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints. %U http://dblp.uni-trier.de/db/journals/mr/mr48.html#YuSKKYS08 %V 48

@article{journals/mr/YuSKKYS08, added-at = {2020-02-22T00:00:00.000+0100}, author = {Yu, Qiang and Shibutani, Tadahiro and Kim, Do-Seop and Kobayashi, Yusuke and Yang, Jidong and Shiratori, Masaki}, biburl = {https://www.bibsonomy.org/bibtex/26c2dc88e67b7964627ff4060d1dfa0ef/dblp}, ee = {https://doi.org/10.1016/j.microrel.2007.08.008}, interhash = {f8f55a6b7e867ac29c95c678316fbb0e}, intrahash = {6c2dc88e67b7964627ff4060d1dfa0ef}, journal = {Microelectron. Reliab.}, keywords = {dblp}, number = 3, pages = {431-437}, timestamp = {2020-02-25T13:22:41.000+0100}, title = {Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr48.html#YuSKKYS08}, volume = 48, year = 2008 }