%0 Conference Paper %1 conf/3dic/LiuSM15 %A Liu, Jiatong %A Suzuki, Ken %A Miura, Hideo %B 3DIC %D 2015 %I IEEE %K dblp %P TS8.5.1-TS8.5.5 %T Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#LiuSM15 %@ 978-1-4673-9385-0

@inproceedings{conf/3dic/LiuSM15, added-at = {2023-09-30T00:00:00.000+0200}, author = {Liu, Jiatong and Suzuki, Ken and Miura, Hideo}, biburl = {https://www.bibsonomy.org/bibtex/28deaf602ad509eb3ba90e0b06a274873/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2015}, ee = {https://doi.org/10.1109/3DIC.2015.7334610}, interhash = {fa07dc1217e54106b94c6e2bf15834d6}, intrahash = {8deaf602ad509eb3ba90e0b06a274873}, isbn = {978-1-4673-9385-0}, keywords = {dblp}, pages = {TS8.5.1-TS8.5.5}, publisher = {IEEE}, timestamp = {2024-04-10T12:10:59.000+0200}, title = {Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2015.html#LiuSM15}, year = 2015 }