%0 Conference Paper %1 conf/iscas/Salman11 %A Salman, Emre %B ISCAS %D 2011 %I IEEE %K dblp %P 1411-1414 %T Noise coupling due to through silicon vias (TSVs) in 3-D integrated circuits. %U http://dblp.uni-trier.de/db/conf/iscas/iscas2011.html#Salman11 %@ 978-1-4244-9472-9

@inproceedings{conf/iscas/Salman11, added-at = {2011-07-07T00:00:00.000+0200}, author = {Salman, Emre}, biburl = {https://www.bibsonomy.org/bibtex/2dc7271cf78dbd2f5f857c5c3ee0276d2/dblp}, booktitle = {ISCAS}, crossref = {conf/iscas/2011}, ee = {http://dx.doi.org/10.1109/ISCAS.2011.5937837}, interhash = {0d7609dc287863fbc8b8b67118aa5f66}, intrahash = {dc7271cf78dbd2f5f857c5c3ee0276d2}, isbn = {978-1-4244-9472-9}, keywords = {dblp}, pages = {1411-1414}, publisher = {IEEE}, timestamp = {2016-05-21T11:53:49.000+0200}, title = {Noise coupling due to through silicon vias (TSVs) in 3-D integrated circuits.}, url = {http://dblp.uni-trier.de/db/conf/iscas/iscas2011.html#Salman11}, year = 2011 }